Exhibition List

Exhibitor List

First Letter Organization / Brand Name Booth
A A*STAR Institute of Microelectronics G-10
ACME ELECTRONICS CORPORATION C-12
Advanced Power Semiconductor Wafer Machining Expo 2027 A-5
Aehr Test Systems F-5
AIXTRON SE G-1
Annealsys C-11
Asahi Diamond M-3
ASM F-8
Atecom Technology Co., Ltd. A-8
ATiS H-7
Axcelis F-3
AYD A-2
B Beijing CGB Technology Co.,Ltd. B-10
Beijing TSD Semiconductor Co., Ltd. F-4
Beneq Oy B-8
Best Compound Semiconductor Co., Ltd. H-6
C CECS J-4
centrotherm H-1
Clas-SiC Wafer Fab C-7
Coherent Corp. E-1
COOLCAD ELECTRONICS F-6
CSconnected J-2
D DAIKIN FINETECH M-4
DASEMITEK G-4
Dynamic Deposit Semiconductor materials (Nantong)Co.,Ltd. L-10
E Engis Corporation K-9
EO Technics Co.,Ltd B-12
EpiWorld J-6
Evatec AG G-5
F FAIRmat M-7
Fraunhofer IISB H-5
Freiberg Instruments GmbH I-1
G Gechi Compound Semiconductor Co., Ltd. (GCCS) M-12
Guangdong Tianyu Semiconductor Co.,Ltd. L-8
Guangzhou Summit Crystal Semiconductor Co.,Ltd B-13
H Hakuto Co.,Ltd. C-9
Hebei Synlight Semiconductor Co., Ltd. K-8
Hengzuan L-7
HITACHI High-tech K-13
HORIBA STEC C-8
Hunan DeZhi New Material Co., Ltd K-2
I ICSCRM2027 M-8
Ion Beam Services K-1
ITES Co.,Ltd. L-4
J JSW Aktina System Co.,Ltd. D-4
K KCINDUSTRIAL K-11
Keller - Pyrometer Systems M-11
KISAB G-6
KLA Corporation B-1
Kohzu Precision Co., Ltd. B-3
KOKUSAI ELECTRIC CORPORATION J-8
KUREHA CORPORATION C-2
L Lapmaster Wolters A-1
Lasertec F-1
M MADDE INC. L-2
MAKINO F-7
Mattson Technology A-4
Meister Abrasives AG L-1
MERSEN E-2
mi2-factory L-3
Mipox Corporation B-9
MIRISE TECHNOLOGIES D-9
Mitsui Kinzoku Co., Ltd. E-5
MONSTR Sense Technologies J-3
Morgan Advanced Materials G-7
N Nanjing Bosi Kousei Seimitsu Technology Co., Ltd K-4
Naso Tech Co.,Ltd. K-10
NEXUSTEST PTE. LTD. B-11
Nikon Corporation M-9
Nippon Kornmeyer Carbon Group D-6
Nissin Ion Equipment E-8
NoMIS Power Corporation J-5
NuFlare Technology, Inc. E-7
O Okamoto Machine Tool Works, Ltd. J-9
Opto Science, Inc. H-4
Oxford Instruments C-9
P Penn State Silicon Carbide Innovation Alliance K-5
POWER: Partnership for Optimized Wide-bandgap Electronics Research M-5
Pureon A-6
PVA TePla AG L-9
Q QureDA Research, inc. K-3
R Red Dot Materials(China) Co.,Ltd K-6
Resonac Corporation F-9
Rigaku Corporation D-1
RISE / Ceramicforum C-3
ROHM Co., Ltd. H-3
S Schunk Ingenieurkeramik GmbH B-4
Schunk Group B-5
SEMILAB E-4
SGL Carbon GmbH C-6
Shanghai Leading Semiconductor Technology Development Co,Ltd. C-4
Shanghai Siplus Semiconductor Co., Ltd. L-6
SHI-ATEX Co., LTD. J-1
SIAMC L-5
SICC CO., LTD. H-2
SiCentury Semiconductor C-5
SOITEC E-9
SOL Corporation K-7
STR G-8
Sumitomo Heavy industries Material Solutions Co., Ltd. J-1
Sumitomo Metal Mining Co., Ltd. G-2
Summit Super Abrasive Co., LTD G-9
T Taisic Materials Corp. E-3
Taiwan Applied Crystal Co., LTD B-7
TanKeBlue Semiconductor Co., Ltd. G-3
Techno Alpha and NI/SET M-1
TES Co., Ltd. D-8
TIME-TECH SPECTRA E-6
TOKAI CARBON GROUP F-2
Tomoe Engineering B-2
Toray Research Center, Inc. K-12
TOYO TANSO D-5
TPEC (Tsukuba Power Electronics Constellations) M-2
U UJ-Crystal Inc. D-2
V Vibrantz A-6
VISIONTEC D-3
W Washington Mills M-10
Western Japan Trading Co., Ltd. A-3
WESTLAKE INSTRUMENTS (HANGZHOU) TECHNOLOGY CO., LTD. F-4
Wolfspeed I-2
Wuxi Leadpro Technology Co., Ltd B-6
X X-FAB SiC Foundry C-1
Y Yokohama City Visitors Bureau M-13
YOKOHAMA MICE Challenge by City of Yokohama M-15
Z ZGYMZN A-7
ZheJiang CrystalYond Semiconductor Co., Ltd. C-10
Zhejiang Jingrui Supersic Electronic Materials Co., Ltd. J-7