Sponsorship Opportunities

The International Conference on Silicon Carbide and Related Materials (ICSCRM) began in Washington D.C. in 1987. ICSCRM 2026 marks the 23rd edition of the series and the sixth time it will be held in Japan. The success of past ICSCRM conferences has been made possible by the generous financial support of companies engaged in this technical field. The organizers sincerely appreciate this continued support and kindly ask for your contribution to the success of ICSCRM 2026 as well.

For ICSCRM 2026, we are pleased to offer a variety of sponsorship packages and additional opportunities to showcase your company's commitment to the wide bandgap materials and power electronics community. These opportunities help highlight each sponsor’s vital role in supporting the organization and success of ICSCRM 2026. We would be sincerely grateful for your kind cooperation and continued support.

Application deadline

First stage : 31 May, 2026
Final stage : 16 August, 2026

Notes:
  • Priority allocation of exhibition space and business meeting room will be granted to sponsors who submit both sponsorship and exhibition (or business meeting room) applications by the first-stage deadline and is valid only until designated booth quotas are filled (see the table below for details).
  • Payment must be completed within one month following your application.
Contact:
ICSCRM2026 Sponsor committee sp-applicationicscrm2026.org

Sponsorship Package

Diamond
JPY 3,000,000
Gold
JPY 1,500,000
Silver
JPY 500,000
Advertisement in the program book 1 page color 1 page color 1/2 page gray scale
Logo exposure in the program book, on the conference website, and on onsite signage Large size Middle size Small size
Priority allocation of exhibition space First priority in choosing exhibition space
If both sponsorship & exhibition applications are submitted by first-stage deadline

Note: Valid only until designated booth quota is filled


Second priority in choosing exhibition space
If both sponsorship & exhibition applications are submitted by first-stage deadline

Note: Valid only until designated booth quota is filled


Priority allocation to the 1st floor main hall
If both sponsorship & exhibition applications are submitted by the first-stage deadline

Note: Specific location selection is not available. Valid only until designated booth quota is filled
Priority allocation of business meeting room Priority in choosing business meeting room
If applications for both sponsorship and business meeting room are submitted by the first-stage deadline

Note: Valid only until designated booth quota is filled
Not eligible Not eligible
Application for supplementary sponsorship items and event support Items: I1 – I5
Events: E1 – E5
(see details below)
Items: I3 – I5
Events: E3 – E5
(see details below)
Events: E4 – E5
(see details below)

Supplementary sponsorship items

Items Benefit Price Availability
I1 Conference Bags Company logo printed on the bag tab distributed to each participant JPY 2,000,000 1
I2 Sake Tasting Cups Company logo printed on cups distributed to each Banquet attendees JPY 1,000,000 1
I3 Name Badges and Lanyards Company logo printed on lanyards distributed to each participant JPY 500,000 1
I4 Pens Company logo printed on pens distributed to each participant JPY 500,000 1
I5 Notepads Company logo printed on notepads distributed to each participant JPY 500,000 1

Notice regarding supplementary sponsorship items:
Only sponsors who have applied for a sponsorship package are eligible to request additional sponsorship items. Selection is limited to one item per sponsor.

Supplementary event supports

Events Benefit Price Availability
E1 Banquet Company logo displayed at the banquet venue + one free conference admission, including banquet participation JPY 2,000,000 No limitation
E2 Welcome Reception Company logo displayed at the welcome reception venue + one free conference admission (banquet not included) JPY 1,500,000 No limitation
E3 Industrial Session Company logo displayed at the industrial session venue + one free conference admission (banquet not included) JPY 1,000,000 No limitation
E4 Coffee Break Company logo displayed in each coffee break area + one free conference admission (banquet not included) JPY 500,000 No limitation
E5 Lunch Company logo displayed at each conference lunch venue + one free conference admission (banquet not included) JPY 500,000 No limitation

Notice regarding supplementary event supports:
Only sponsors who have applied for a sponsorship package are eligible to request additional event supports. There is no limit to the number of units that may be purchased.

Disclaimer

Please note that the information provided on this webpage may be subject to change due to venue availability or other unforeseen circumstances. We appreciate your understanding and cooperation.

ICSCRM 2026

International Conference on
Silicon Carbide and Related Materials 2026

September 27 - October 2, 2026
Yokohama, Japan
International Conference on Silicon Carbide and Related Materials 2026
© ICSCRM 2026 Organizing Committee.