Welcome Message

On behalf of the organizing committee, it is my great honor and pleasure to welcome you to Yokohama, Japan, for the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026), September 27－October 2, 2026.

The ICSCRM conference series is the premier international forum focusing on all aspects of silicon carbide and related materials. With the goal of achieving carbon neutrality through significant energy savings, the importance of low-loss power devices using silicon carbide and related materials is increasing. Currently, efforts are being made to enhance the materials, improve the performance and reliability of the devices, and increase productivity to expand practical applications. Ongoing work to develop implementation and circuit technologies to fully utilize the device performance also continues. In the basic research field, new developments such as applications in harsh environments and quantum sensing are underway.

In this context, we have planned ICSCRM 2026 to bring researchers and engineers together to exchange the latest research and development results and share information on state-of-the-art technologies and products in the field of silicon carbide and related materials. We also hope to create opportunities for international exchanges among researchers and engineers in this field. Your attendance in scientific discussions and technical exhibitions will enhance the outcome of ICSCRM 2026 and create further steps for the future.

Once again, we welcome all presenters, participants, exhibitors, and sponsors to ICSCRM 2026 and hope all attendants enjoy the conference.

Sincerely,

Hidekazu Tsuchida (CRIEPI)
General Chair, ICSCRM 2026